Fabric with embedded electrical components

ABSTRACT

Electrical components may have plastic packages. Contacts may be formed on exterior surfaces of the plastic packages. A plastic package for an electrical component may have an elongated shape that extends along a longitudinal axis. A first groove may run parallel to the longitudinal axis on a lower surface of the plastic package. A second groove may run perpendicular to the first groove on an opposing upper surface of the plastic package. The electrical components may be coupled to fibers in a fabric such as a woven fabric. A first solder connection may be formed between the first groove and a first fiber such as a weft fiber. A second solder connection may be formed between the second groove and a second fiber such as a warp fiber.

This application is a continuation of patent application Ser. No.15/514,440, filed Mar. 24, 2017, which is a national stage application,filed under 35 U S C. § 371, of international patent application No.PCT/US2015/050434, filed Sep. 16, 2015 which claims the benefit ofprovisional patent application No. 62/057,368, filed Sep. 30, 2014, allof which are incorporated by reference herein in their entireties.

BACKGROUND

This relates generally to electronic devices, and, more particularly, toelectronic devices having electrical components mounted to fabric.

Fabric can be provided with metal wires and other conductive fibers.These fibers can be used to carry signals for electrical components. Anelectronic device can be formed from a fabric that contains electricalcomponents.

Challenges may arise when mounting electrical components to fabric. Ifcare is not taken, stresses on the fabric will tend to dislodge theelectrical components. Short circuits can develop if signal paths arenot properly isolated. Overly prominent mounting arrangements may beunsightly.

It would be desirable to be able to address these concerns by providingimproved techniques for mounting electrical components to fabric for anelectronic device.

SUMMARY

An electronic device may include fabric formed from intertwined fibers.Electrical components may be mounted to the fibers. The fibers mayinclude conductive fibers that convey signals between the electricalcomponents and control circuitry in the electronic device.

Component contacts may be formed on a package for a component. Eachcomponent may be coupled to fibers in the fabric using electricalconnections. The fabric may be a woven fabric having warp and weftfibers or other suitable fabric.

A first electrical connection may be formed between a first contact anda first fiber. A second electrical connection may be formed between asecond contact and a second fiber. Optional additional connections mayalso be made with one or more other fibers. The connections may beformed using different types of connection materials and/or differenttypes of connection structures.

Fabric configurations may also be used in which fibers in the fabricoverlap the component to help hold the component in place.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an illustrative electronic device inaccordance with an embodiment.

FIG. 2 is a schematic diagram of an illustrative electronic device inaccordance with an embodiment.

FIG. 3 is a diagram of illustrative equipment for forming an electronicdevice that includes electrical components mounted to fabric inaccordance with an embodiment.

FIG. 4 is a side view of illustrative weaving equipment that may be usedto form fabric in accordance with an embodiment.

FIG. 5 is aside view of an illustrative pick-and-place machine formounting electrical components to fabric in accordance with anembodiment.

FIG. 6 is a top view of a portion of an illustrative fabric inaccordance with an embodiment.

FIG. 7 is a perspective view of an illustrative electrical componenthaving a package of the type that may be used to facilitate attachmentof the electrical component to a fabric in accordance with anembodiment.

FIG. 8 is a perspective view of the electrical component of FIG. 7following attachment to fibers in a fabric in accordance with anembodiment.

FIG. 9 is a diagram of a portion of a weaving machine showing how a weftfiber may be inserted between two sets of warp fibers in accordance withan embodiment.

FIG. 10 is a diagram of the weaving machine of FIG. 9 showing how apick-and-place machine may be used in aligning an electronic componentwith a weft fiber after the weft fiber has been inserted between thewarp fibers in accordance with an embodiment.

FIG. 11 is a diagram of the weaving machine of FIG. 10 followingattachment of the electronic component to the weft fiber with thepick-and-place machine in accordance with an embodiment.

FIG. 12 is a diagram of the weaving machine of FIG. 11 in aconfiguration in which a reed in the weaving machine is pushing the weftfiber into place in accordance with an embodiment.

FIG. 13 is a diagram of the weaving machine of FIG. 12 following removalof the reed from the weft fiber and movement of the upper warp threadson top of the electrical component so that the pick-and-place machinecan attach the electrical components to a signal path in the upper warpthreads in accordance with an embodiment.

FIG. 14 is a diagram of the weaving machine of FIG. 13 showing how theweaving process may continue following attachment of the electricalcomponent to both weft and warp fibers in accordance with an embodiment.

FIG. 15 is a flow chart of illustrative steps involved in attachingelectrical components to fibers while forming a fabric for an electronicdevice in accordance with an embodiment.

FIG. 16 is a perspective view of an illustrative electrical componentwith parallel grooves for fiber attachment in accordance with anembodiment.

FIG. 17 is a top view of an illustrative electrical component of thetype shown in FIG. 16 following mounting to fibers in a fabric inaccordance with an embodiment.

FIG. 18 is a side view of the illustrative electrical component andfabric of FIG. 17 in accordance with an embodiment.

FIG. 19 is a schematic diagram of an illustrative component incorporatedinto fabric in accordance with an embodiment.

FIG. 20 is a diagram of an illustrative component with a circular shapethat is coupled to fibers in a fabric in accordance with an embodiment.

FIG. 21 is a diagram of an illustrative component with a C shape that iscoupled to fibers in a fabric in accordance with an embodiment.

FIG. 22 is a diagram of an illustrative component with a square shapethat is coupled to fibers in a fabric in accordance with an embodiment.

FIG. 23 is a diagram of an illustrative component with across shape thatis coupled to fibers in a fabric in accordance with an embodiment.

FIG. 24 is a diagram of an illustrative component with a trapezoidalshape that is coupled to fibers in a fabric in accordance with anembodiment.

FIG. 25 is a diagram of an illustrative component with a shape having acombination of curved and straight edges that is coupled to fibers in afabric in accordance with an embodiment.

FIG. 26 is a side view of an illustrative electrical component having acrimped fiber connection in accordance with an embodiment.

FIG. 27 is a side view of an illustrative electrical component having apair of crimped fiber connections on a component body with a roundededge profile in accordance with an embodiment.

FIG. 28 is a side view of an illustrative electrical component having apress-fit fiber connection in accordance with an embodiment.

FIG. 29 is a side view of an illustrative electrical component having aclamped fiber connection in accordance with an embodiment.

FIG. 30 is a side view of an illustrative electrical component having amolded fiber connection in accordance with an embodiment.

FIG. 31 is a side view of an illustrative electrical component having afastener that forms a fastener-based fiber connection in accordance withan embodiment.

FIG. 32 is a side view of an illustrative electrical component having awelded fiber connection in accordance with an embodiment.

FIG. 33 is a side view of an illustrative electrical component having awrapped fiber connection formed from fibers wrapped around the componentin accordance with an embodiment.

DETAILED DESCRIPTION

An electronic device such as electronic device 10 of FIG. 1 may containfabric. One or more electrical components may be mounted to the fabric.The electrical components may include audio components, sensors,light-emitting diodes and other light-based components, buttons,connectors, batteries, microelectromechanical systems devices,integrated circuits, packaged components, discrete components such asinductors, resistors, and capacitors, switches, and other electricalcomponents. Device 10 may include control circuitry and a power sourcesuch as a battery for providing electrical signals to the electricalcomponents.

The electronic device that contains the fabric may be an accessory for acellular telephone, tablet computer, wrist-watch device, laptopcomputer, or other electronic equipment. For example, the electronicdevice may be a removable external case for electronic equipment, may bea strap, may be a wrist band or head band, may be a removable cover fora device, may be a case or bag that has straps or that has otherstructures to receive and carry electronic equipment and other items,may be a necklace or arm band, may be a wallet, sleeve, pocket, or otherstructure into which electronic equipment or other items may beinserted, may be par of a chair, sofa, or other seating, may be part ofan item of clothing, or may be any other suitable fabric-based item. Ifdesired, the fabric may be used in forming part of an electronic devicesuch as a laptop computer, a computer monitor containing an embeddedcomputer, a tablet computer, a cellular telephone, a media player, orother handheld or portable electronic device, a smaller device such as awrist-watch device, a pendant device, a headphone or earpiece device, adevice embedded in eyeglasses or other equipment worn on a user's head,or other wearable or miniature device, a television, a computer displaythat does not contain an embedded computer, a gaming device, anavigation device, an embedded system such as a system in whichfabric-based equipment is mounted in a kiosk, in an automobile or othervehicle, equipment that implements the functionality of two or more ofthese devices, or other electronic equipment.

The fabric to which the electrical components have been mounted may formall or part of an electronic device, may form all or part of a housingwall for an electronic device, may form internal structures in anelectronic device, or may form other fabric-based structures. Thefabric-based device may be soft (e.g., the device may have a fabricsurface that yields to a light touch), may have a rigid feel (e.g., thesurface of the device may be formed from a stiff fabric), may be coarse,may be smooth, may have ribs or other patterned textures, and/or may beformed as part of a device that has portions formed from non-fabricstructures of plastic, metal, glass, crystalline materials, ceramics, orother materials.

In the illustrative configuration of FIG. 1 , device 10 has portionsthat may be formed from fabric such as upper face 12-1 and sidewalls12-2. Electrical components 20 have been mounted to fibers within thefabric. Openings in the fabric may, if desired, be used to accommodatecomponents such as buttons 22, button 16, and connector 18 or componentssuch as components 16, 18, and 22 may be omitted. If desired, an openingmay be formed in the fabric to receive mating equipment or other items(e.g., when device 10 is being used as a case). Electrical components 20may be mounted to the fabric of device 10 in regular arrays having rowsand columns, may be mounted in a pseudo-random pattern, may be mountedin linear arrays, or may be incorporated into the fabric of device 10using other suitable patterns. In the example of FIG. 1 , components 20cover the upper surface of device 10 and the edges of device 10.Components 20 may also cover the lower surface of device 10, may coveronly a portion of some or all of the surfaces of device 10, or may beformed on part or all of a single side of device 10. The illustrativelayout of components 20 of FIG. 1 and the illustrative shape of device10 of FIG. 1 are merely provided as examples.

A schematic diagram of an illustrative electronic device that mayinclude fabric to which one or more components 20 have been mounted isshown in FIG. 2 . As shown in FIG. 2 , device 10 may includeinput-output devices 26. Devices 26 may include components 20. Controlcircuitry 24 may use conductive fibers in the fabric and/or otherconductive signal paths to provide electrical signals to devices 26 andcomponents 20 during operation. Components 20 may be used to form touchsensor arrays, acoustic sensor arrays, arrays of other sensors, audiocomponent arrays, connector arrays, displays, status indicators, logos,decorative patterns, or other fabric-based structures that arecontrolled by control circuitry 24 and/or are powered by a battery orother power source for device 10.

If desired, control circuitry 24 may include storage and processingcircuitry for supporting the operation of device 10. The storage andprocessing circuitry may include storage such as hard disk drivestorage, nonvolatile memory (e.g., flash memory or otherelectrically-programmable-read-only memory configured to form a solidstate drive), volatile memory (e.g., static or dynamicrandom-access-memory), etc. Processing circuitry in control circuitry 24may be used to control the operation of device 10. The processingcircuitry may be based on one or more microprocessors, microcontrollers,digital signal processors, baseband processors and other wirelesscommunications circuits, system-on-chip processors, power managementunits, audio chips, application specific integrated circuits, etc.

Input-output circuitry in device 10 such as input-output devices 26(e.g., components 20 and/or other components) may be used to allow datato be supplied to device 10 and to allow data to be provided from device10 to external devices. Input-output devices 26 may include buttons,joysticks, scrolling wheels, touch pads, key pads, keyboards,microphones, speakers, tone generators, vibrators, cameras, sensors suchas touch sensors, capacitive proximity sensors, light-based proximitysensors, ambient light sensors, compasses, gyroscopes, accelerometers,moisture sensors, light-emitting diodes and other visual statusindicators, data ports, connectors, switches, audio components,integrated circuits, etc. A user can control the operation of device 10by supplying commands through input-output devices 26 and/or may receivestatus information and other output from device 10 using the outputresources of input-output devices 26. Components 20 that have beenmounted to fabric in device 10 may be used to gather input and/orprovide output and/or other components 26 may be used to gather inputand/or provide output.

Control circuitry 24 may be used to run software on device 10 such asoperating system code and applications. During operation of device 10,the software running on control circuitry 24 may display images for auser on one or more displays and may use other devices withininput-output devices 26. For example, the software running on controlcircuitry 24 may be used to process input from a user using one or moresensors (e.g., capacitive touch sensors, mechanical sensors, thermalsensors, force sensors, switches, buttons, touch screen displays, andother components) and may be used to provide status indicator output andother visual and/or audio output. Control circuitry 24 may also usedevices 26 to provide vibrations and other physical output (e.g., hapticoutput). Devices 26 may, for example, include solenoids, vibrators, orother components that provide physical feedback (e.g., vibrations) to auser in conjunction with a button press, touch input, or other useractivity. Changes in fabric attributes such as fabric temperature,texture, size, and shape may also be produced using devices 26 to conveyoutput to a user.

Illustrative equipment of the type that may be used in mounting one ormore electrical components to fabric for device 10 is shown in FIG. 3 .As shown in FIG. 3 , the equipment of FIG. 3 may be provided with fibersfrom fiber source 28. The fibers provided by fiber source 28 may besingle-strand filaments or may be threads, yarns, or other fibers thathave been formed by intertwining single-strand filaments. Fibers may beformed from polymer, metal, glass, graphite, ceramic, natural materialssuch as cotton or bamboo, or other organic and/or inorganic materialsand combinations of these materials. Conductive coatings such as metalcoatings may be formed on non-conductive fiber cores. Fibers may also beformed from single filament metal wire or stranded wire. Fibers may beinsulating or conductive. Fibers may be conductive along their entirelength or may have conductive segments (e.g., metal portions that areexposed by locally removing polymer insulation from an insulatedconductive fiber). Threads and other multi-strand fibers that have beenformed from intertwined filaments may contain mixtures of conductivefibers and insulating fibers (e.g., metal fibers or metal coated fiberswith or without exterior insulating layers may be used in combinationwith solid plastic fibers or natural fibers that are insulating).

The fibers from fiber source 28 may be intertwined using intertwiningequipment 30. Equipment 30 may include weaving tools, knitting tools,tools for forming braided fabric, or other equipment for intertwiningthe fibers from source 28. Equipment 30 may be automated. For example,equipment 30 may include computer-controlled actuators that manipulateand intertwine fibers from source 28.

Components 20 may be attached to fibers in the fabric formed withequipment 30. For example, computer-controlled equipment such aspick-and-place tool 32 may be used to attach components 20 to thefibers. Components 20 may have conductive contacts (e.g., contactsformed from metal or other conductive material). Equipment 32 may attacheach conductive contact in a component 20 to a respective conductivefiber using conductive connections such as solder joints, conductiveadhesive connections (e.g., conductive epoxy connections), welds,crimped connections, spring contacts, connections formed using clamps,fasteners, or other structures to press metal contacts againstconductive fibers, etc. Arrangements in which equipment 32 uses solderto attach components 20 to fibers from source 28 that are being formedinto fabric by tool 30 are sometimes described herein as an example.This is, however, merely illustrative. In general, any suitableconductive attachment mechanism may be used to electrically couple oneor more terminals in each component 20 to a respective conductive fiberin a fabric for device 10. Adhesive and other attachment mechanisms mayalso be used to attach insulating fibers to component 20.

After using intertwining tool 30 and pick-and-place tool 32 to formfabric and other structures 34 with embedded components 20, additionalprocessing steps may be performed using equipment 36. Equipment 36 mayinclude equipment for assembling control circuitry 24, components 26,and other structures for device 10 with the fabric produced by equipment32 and 30, thereby forming all or part of finished device 10. Equipment36 may include injection molding tools, tools for applying coatings,cutting and machining equipment, assembly equipment for attachingstructures together using fasteners, adhesive, and other attachmentmechanisms, equipment for interconnecting connectors on printed circuitsand other signal path substrates, etc.

If desired, intertwining tool 30 may be a weaving machine. Illustrativeweaving equipment is shown in FIG. 4 . As shown in FIG. 4 , weavingequipment 30 includes a source of warp fibers such as source 70. Source70 may include a drum or other structure such as drum 42 that rotatesabout rotational axis 44 in direction 46. Warp fibers 40-1 and warpfibers 40-2 may be dispensed as drum 42 rotates.

Warp fibers 40-1 may be positioned using computer-controlled positioner50-1 and needles 48-1 or other fiber guiding structures. Warp fibers40-2 may be positioned using computer-controlled positioner 50-2 andneedles 48-2 or other fiber guiding structures. Positioners 50-1 and50-2 may travel along vertical axis 52 (e.g. to move warp fibers 40-1down while moving warp fibers 40-2 up to swap the positions of fibers40-1 and 40-2).

Shuttle 58 or other weft fiber positioning equipment may be used toinsert weft fiber 60 between warp fibers 40-1 and 40-2 (e.g., by movingweft fiber 60 into the page and out of the page in the orientation ofFIG. 4 . After each pass of shuttle 58, reed 55 may be moved indirection 56 (and then retracted) to push the weft fiber that has justbeen inserted between warp fibers 40-1 and 40-2 against previously wovenfabric 62, thereby ensuring that a satisfactorily tight weave isproduced. Fabric 62 that has been woven in this way may be gathered ondrum 66 as drum 66 rotates in direction 64 about rotational axis 68.

The equipment of FIG. 4 may be controlled using computing equipment. Forexample, computing equipment may control the positions of needles 48-1and 48-2 using positioners 50-1 and 50-2 and computer-controlledpositioners may be used in controlling the movement of reed 55, shuttle58, and drums 42 and 66. The computing equipment may also controlequipment for installing components 20 in fabric 62. With one suitablearrangement, computer-controlled equipment such as pick-and-placemachine 32 of FIG. 3 may be used to solder components 20 to fibers infabric 62.

An illustrative pick-and-place machine is shown in FIG. 5 . As shown inFIG. 5 , pick-and-place machine 32 may include computer-controlledactuators such as computer-controlled positioner 84. Positioner 84 maybe used to position pick-and-place head 82. Head (nozzle) 82 may includea vacuum suction structure or other gripping device for grippingcomponents such as component 20. Components 20 may be fed into machine32 on a reel of tape or other suitable component dispensing structure.

When it is desired to mount component 20 to a fiber in fabric 62 such asfiber 74 (e.g., a warp fiber or a weft fiber in a woven fabric), head 82may be positioned so that conductive material 76 is interposed betweencomponent 20 and fiber 74. Fiber 74 may be a bare metal wire, ametal-coated insulating fiber, a metal wire or metal-coated insulatingfiber with a locally stripped insulating coating, a multi-strand fiberthat contains at least one metal fiber or metal-coated fiber, or otherconductive fiber. Component 20 may have metal contacts such as contact78. Conductive material 76 may be solder, conductive adhesive, or otherconductive material for connecting contact 78 to conductive fiber 74 andthereby electrically and mechanically joining component 20 to fiber 74.Conductive material 76 such as solder may be dispensed in the form ofsolder paste that is heated (reflowed) using a heating element in head82 and/or using an external source of heat. Solder paste 76 may becarried with components 20 on the tape reel in machine 32, may beapplied as part of the process of attaching component 20 to fiber 74,and/or may be applied to fiber 74 before mounting component 20. Ifdesired, different types of solder may be used in forming joints fordifferent contacts 78 on a single component. For example, solders thatmelt (flow) at different temperatures may be used to form differentconnections.

FIG. 6 is atop view of an illustrative fabric having fibers 74 to whichcomponents 20 may be mounted using pick-and-place tool 32. In theexample of FIG. 6 , fabric 62 is a woven fabric that has a plain weaveand includes warp fibers 40-1 and 40-2 and weft fibers 60. In general,fabric 62 may include any intertwined fibers 74 (woven, knitted,braided, etc.). The plain weave fabric of FIG. 6 is merely illustrative.Fabric 62 may contain conductive fibers and/or may contain a mixture ofconductive and insulating fibers. The contacts 78 of components 20 maybe electrically coupled to the conductive fibers in fabric 62.

Illustrative soldering locations 86 of the type where contacts 78 ofcomponents 20 may be soldered to fibers 74 are shown in FIG. 6 .Components 20 may have two or more terminals (contacts 78), three ormore terminals, four or more terminals, or other suitable number ofterminals. In configurations in which components 20 each have a pair ofterminals, one terminal may be coupled to a conductive warp fiber andanother terminal may be coupled to a conductive weft fiber, first andsecond terminals may be coupled to a common conductive warp fiber or totwo different conductive warp fibers, or first and second terminals maybe coupled to a common conductive weft fiber or to two differentconductive weft fibers. In configurations in which components 20 eachhave three or more terminals, additional combinations of warp and weftfibers may be coupled to the terminals. A pair of soldering locations 86for a component may be located on horizontally adjacent fibers 74, maybe located on vertically adjacent fibers 74, may be located along adiagonal line that runs across fabric 62, may be formed on fibers 74that are separated by intervening insulating fibers 74 or other fibers74 to which connections are not made, or may be located on any othersuitable first and second respective positions on fibers 74.

FIG. 7 is a perspective view of an illustrative electrical component ofthe type that may be attached to fibers 74 in fabric 62. In the exampleof FIG. 7 , component 20 has a package such as package 90. Package 90may be formed from plastic, ceramic, or other materials. Component 20may include one or more electrical devices such as device 92. Devicessuch as device 92 may include one or more semiconductor dies or othercircuits. For example, device 92 may be a silicon integrated circuit, asilicon-based microelectromechanical systems device such as a sensor, acapacitor, inductor, or resistor, a compound semiconductor die thatforms a light-emitting diode or light detector, a semiconductorsubstrate that is configured to form a membrane for a microphone or adiving board structure for a sensor or other component, or semiconductorswitch or driver circuit, or other suitable electrical device. Devices92 may be shielded using conductive shield structures and may be encasedwithin an enclosure such as package 90. If desired, a printed circuitboard or other substrate with traces may be enclosed within package 90(e.g., devices 92 may be mounted to a printed circuit before encasingthe printed circuit and devices 92 within a plastic package body usinginjection molding techniques). Signal lines in component 20 may beformed from metal traces 94 on a printed circuit or other structures incomponent 20. Metal traces 94 may be used to couple the terminals ofelectrical device 92 or other circuitry to component contacts incomponent 20.

If desired, package body 90 may be provided with fiber guidingstructures that receive and hold fibers 74. The guiding structures mayinclude posts, walls, or other protrusions, flat sided and curvedrecesses forming grooves, combinations of protrusions and recesses, orother structures that receive fibers 74 and help prevent fibers 74 fromslipping off of body 90. In the illustrative example of FIG. 7 , packagebody 90 has grooves such as grooves 96 and 96′ The upper surface of body90 has parallel grooves and the lower surface of body 90 has aperpendicular groove.

Contacts for component 20 may be formed in these grooves or elsewhere onthe exterior of body 90. For example, a first contact such as contact78A may be formed on a first of grooves 96 and a second contact such ascontact 78B may be formed on a second of grooves 96. Contacts 78A and78B may be formed from a solder-compatible metal. Traces 94 may couplecontacts 78A and 78B to respective electrical terminals of device 92and/or other circuitry in package body 90. If desired, component 20 mayhave additional contacts. For example, an additional contact may beformed in groove 96′ and may be soldered to another conductive fiber.Insulating fibers and other fibers may also be mounted in groove 96′using adhesive (e.g., to provide structural support without providingany electrical signal path). The arrangement of FIG. 7 is merelyillustrative.

In the example of FIG. 7 , component 20 has an elongated shape thatextends along longitudinal axis 100. Contact 78B extends along thegroove in package 90 that runs parallel to axis 100. Contact 78A extendsalong the groove in package 90 that runs along perpendicular axis 102.When installed within fabric 62, axis 100 may be aligned with weftfibers 60 and axis 102 may be aligned with warp fibers 40-1 and 40-2 (orvice versa). As shown in FIG. 8 , for example, contact 78B may be a weftfiber contact that is soldered to weft fiber 60 with solder 76B andcontact 78A may be a warp fiber contact that is soldered to warp fiber40-1 with solder 76A. Warp fiber 40-2 may be an insulating fiber that isattached to package 90 with adhesive but that is not electricallycoupled to a contact in component 20 or warp fiber 40-2 may be aconductive fiber that is soldered to a contact in groove 58′.

If desired, solder 76B and solder 76A may be formed from different typesof solder and may exhibit different melting temperatures. This mayfacilitate attachment of component 20 to fabric 62 using pick-and-placeequipment 32 as fabric 62 is woven using equipment 30.

Illustrative steps involved in mounting component 20 to fabric 62 duringweaving operations are shown in FIGS. 9, 10, 11, 12, 13, and 14 .

FIG. 9 is a diagram of a portion of weaving machine being used toproduce fabric 62. As shown in FIG. 9 , woven fabric 62 includes weftfibers 60′ intertwined with warp fibers 40-1 and 40-2. Using equipmentof the type shown in FIG. 4 , a wet fiber such as wet fiber 60 may beinserted between warp fibers 40-1 and warp fibers 40-2.

Following insertion of weft fiber 60, a pick-and-place machine such aspick-and-place machine 32 of FIG. 3 may bring component 20 intoalignment with weft fiber 60, as shown in FIG. 10 .

Pick-and-place machine 32 may then solder contact 78B of component 20 toweft fiber 60 using solder 76B, as shown in FIG. 11 . Solder 76B mayhave a first melting temperature T1 (e.g., 180° C. or other suitabletemperature).

After component 20 has been soldered to weft fiber 60 using contact 78B,reed 55 may be moved (e.g., rotated) in direction 56 to press weft fiber60 in place between warp fibers 40-1 and 40-2, as shown in FIG. 12 . Asreed 55 moves, component 20 may rotate freely in response to anyrotation of the weft fiber 60 to which component 20 is attached.

As shown in FIG. 13 , reed 55 may then be moved in direction 57 andneedles 48-1 and 48-2 may be moved to switch the locations of warpfibers 40-1 and warp fibers 40-2. As the warp fibers swap locations, thewarp fibers adjacent to component 20 are received within warp fibergrooves 96 and 96′ on the upper surface of package 90, thereby lockingcomponent 20 in place within fabric 62. To secure component 20 andcomplete the electrical coupling process, pick-and-place machine 32 maysolder contact 78A to the warp line in groove 96 using solder 76A (and,if desired, may form a solder connection to the warp line in groove 96′using a real contact or a dummy contact at the opposing end of package90). Solder 76A may have a second melting temperature T2 (e.g., 160° C.or other suitable temperature). Melting temperature T2 may be lower thanmelting temperature T1, so the soldering operations used in forming thesecond solder joint for the warp fiber(s) do not disrupt the previouslyformed solder joint for the weft fiber.

Once warp fiber soldering operations have been completed, weaving cancontinue by passing weft fiber 60 back through warp fibers 40-2 and40-1, as shown in FIG. 14 .

Any suitable number of components 20 may be soldered to fabric 62 usingpick-and-place machine 32 (e.g., one, two or more, ten or more, onehundred or more, one thousand or more, less than 5,000, 1000-100,000,more than 500,000, etc.). The components that are soldered to fabric 62may all be of the same type or a mixture of different types ofcomponents may be used.

Illustrative steps involved in forming fabric 62 using operations of thetype shown in FIGS. 9, 10, 11, 12, 13, and 14 are shown in the flowchart of FIG. 15 .

At step 120, weft fiber 60 may be inserted between warp fibers 40-1 and40-2 using shuttle 58 in weaving machine 30.

At step 122, pick-and-place machine 32 may solder component 20 to weftfiber 60 using solder 76B and contact 78B (i.e., so that longitudinalaxis 100 of package 90 runs parallel to weft fiber 60).

At step 124, reed 55 pushes weft fiber 60 into place. Component 20 mayrotate freely with any rotation of fiber 60.

At step 126, the positions of warp fibers 40-1 and 40-2 are swapped. Aspart of this process, one or more of the warp fibers are received withinthe groove structures or other guiding structures formed in package 90of component 20. Pick-and-place machine 32 solders one or more warpfibers to component 20. For example, the warp fiber 40-1 in groove 96may be soldered to contact 78A using solder 76A. Solder 76A may have alower melting point than solder 76B, so that the solder joint that wasformed with solder 76B will not be disrupted while forming the solderjoint with solder 76A.

Weaving may then continue, as illustrated by line 128 of FIG. 15 .

If desired, other arrangements may be used for securing conductivefibers in fabric 62 to contacts in component 20 (e.g., crimped metaltabs, holes lined with metal contacts, grooves that run across package90 diagonally or with other configurations, mating parts in package 90that clamp onto conductive fiber, etc.). Some fibers may overlap package90 and may help to hold package 90 and components 20 in place withinfabric 62. A configuration that may be used for package 90 in this typeof arrangement is shown in FIG. 16 .

Package 90 of component 20 of FIG. 16 has first groove 96-1 and secondgroove 96-2, each of which may have a respective electrical contact forcomponent 20. Grooves 96-1 and 92-2 may be parallel grooves or otherfiber guiding structures that are formed on opposing ends (sides) ofcomponent 20 and that are configured to receive respective conductivefibers in fabric 62 (e.g., warp or weft fibers).

FIG. 17 is a top view of electrical component 20 of FIG. 16 in anillustrative configuration in which a first warp fiber 40A among warpfibers 40 has been soldered to a contact in groove 96-1 and a secondwarp fiber 40B has been soldered to a contact in groove 96-2. Three warpfibers 40E overlap package 90. If desired, one warp fiber 40E mayoverlap package 90 or more than two fibers 40E may overlap package 90.Warp fibers 40E lie between fibers 40A and 40B and run parallel tofibers 40A and 40B. Fibers 40E may be insulating fibers or conductivefibers.

FIG. 18 is a cross-sectional side view of component 20 of FIG. 17 takenalong line 130 and viewed in direction 132. As shown in FIG. 18 , warpfibers 40E may help hold component 20 in place on top of weft fiber 60in fabric 62 by forming a retention pocket for package 90.

In general, components 20 may be embedded into fabric 62 during anysuitable fiber intertwining operations (e.g., during weaving, knitting,braiding, etc.) using any suitable type of component mounting equipmentand fiber intertwining equipment. The mounting equipment may includeheating elements for melting solder, forming welds, curing adhesive,molding package 90, etc., and/or may include mechanical equipment forscrewing screws into package 90, for crimping metal tabs, and otherwisemechanically processing components 20 (e.g., to form electricalconnections with fibers). The mounting equipment may also includeequipment for dispensing adhesive, for applying light (e.g., laserlight), for manipulating fibers, etc.

As shown in the schematic diagram of FIG. 19 , component 20 may have oneor more contacts 78 that are electrically connected to one or morefibers 74 using one or more respective electrical connections 134.Component 20 may have a body with any suitable shape (circular, oblong,spherical, box-shaped, pyramidal, etc.), may have a body formed from anysuitable material (plastic, glass, ceramic, crystalline material, metal,fiber-based composites, etc.), and may contain any suitable electronicdevice or devices such as light-emitting components, integratedcircuits, light-emitting diodes, light-emitting diodes that are packagedwith transistor-based circuitry such as communications circuitry and/orlight-emitting diode driver circuitry that allows each component tooperate as a pixel in a display, discrete components such as resistors,capacitors, and inductors, audio components such as microphones and/orspeakers, sensors such as touch sensors (with or without co-locatedtouch sensor processing circuitry), accelerometers, temperature sensors,force sensors, microelectromechanical systems (MEMS) devices,transducers, solenoids, electromagnets, pressure sensors, light-sensors,proximity sensors, buttons, switches, two-terminal devices,three-terminal devices, devices with four or more contacts, etc.Electrical connections 134 may be formed using solder, conductiveadhesive, welds, molded package parts, mechanical fasteners, wrappedfiber connections, press-fit connections, and other mechanicalconnections, or using any other suitable arrangement for forming anelectrical short between conductive structures.

As shown in FIG. 20 , component 20 may have a circular body that isconnected to one or more fibers 74.

FIG. 21 is a diagram of an illustrative component with a C-shape bodythat is coupled to fibers 74.

FIG. 22 shows how body 90 of component 20 may have a square shape.

FIG. 23 shows how body 90 of component 20 may have a cross shape.

FIG. 24 shows how body 90 of component 20 may have a trapezoidal shape.

In the example of FIG. 25 , body 90 has a shape with a combination ofcurved and straight edges.

Other shapes may be used for body 90 if desired. The examples of FIGS.20, 21, 22, 23, 24, and 25 are merely illustrative. Moreover, any numberof fibers 74 may be coupled to any of these body types and/or components20 of other shapes (e.g., one warp fiber and one weft fiber, two warpfibers and one weft fiber, two weft fibers and one warp fiber, multiplewarp fibers, multiple wet fibers, three or more fibers of any time,fibers in a knitted or braided fabric, etc.).

FIGS. 26, 27, 28, 29, 30, 31, 32, and 33 are side views of illustrativecomponents 20 (or portions of components 20) showing various connectionarrangements (e.g., examples of connection 134 of FIG. 19 ).

FIG. 26 is a side view of component 20 in a configuration in whichcontact 78 is formed of metal (e.g., a bendable metal tab) or otherconductive material that forms a crimped electrical connection to fiber74.

FIG. 27 is a side view of component 20 in a configuration with a pair ofcrimped fiber connections are being made to fibers 74 and in which body90 has a rounded edge profile.

FIG. 28 is a side view of an illustrative electrical component having apress-fit fiber connection. In this type of arrangement, fiber 74 isforced through narrow opening 160, which causes portions 162 of body 90to temporarily spread outward. When portions 162 relax in directions164, fiber 74 is pressed against contact 78.

As shown in FIG. 29 , body 90 may have two portions that are coupledusing adhesive 140, thereby trapping fiber 74 against contact 78 (i.e.,component 20 may form a clamped-fiber connection to fiber 74).

FIG. 30 shows how body 90 may be molded around contact 78 and fiber 74(e.g., using plastic molding equipment). Contact 78 may be, for example,a metal structure that is crimped onto fiber 74 during the fabricformation process. Molded connections of the type shown in FIG. 30 maybe formed by molding plastic in body 90 around fiber 74 or by otherwiseusing heat to cause plastic or other material to mold into a desiredshape to form an electrical connection with fiber 74.

As shown in FIG. 31 , fasteners such as screw 142 may be screwed intobody 90 to hold fiber 74 against contact 78.

As shown in FIG. 32 , laser light 146 or heat from another source may beused to weld fiber 74 (e.g., a metal fiber) onto contact 78. Weldedconnections may be formed without using solder or may be combined withsolder-based connection arrangements or other electrical connections.

In the illustrative arrangement of FIG. 33 , one or more loops of fibers74 are wrapped around body 90 against contact(s) 96, thereby forming awrapped-fiber electrical connection between fiber(s) 74 and component20.

If desired, additional types of connections may be used in couplingfibers 74 to components 20. The arrangements of FIGS. 26, 27, 28, 29,3031, 32, and 33 are merely illustrative.

The foregoing is merely illustrative and various modifications can bemade by those skilled in the art without departing from the scope andspirit of the described embodiments. The foregoing embodiments may beimplemented individually or in any combination.

What is claimed is:
 1. A fabric-based item, comprising: a woven fabricformed from interwoven fibers, wherein the interwoven fibers include afirst set of fibers that extend in a first direction and a second set offibers that extend in a second direction; and an electrical componenthaving first and second opposing surfaces and having first and secondcontacts on the first surface, wherein a first fiber of the first set offibers is coupled to the first contact in a first fiber guidingstructure and a second fiber of the first set of fibers is coupled tothe second contact in a second fiber guiding structure and wherein athird fiber of the first set of fibers lies between the first and secondfibers of the first set of fibers and contacts the second surface of theelectrical component.
 2. The fabric-based item defined in claim 1wherein the first and second fibers of the first set of fibers areconductive fibers.
 3. The fabric-based item defined in claim 2 whereinthe conductive fibers comprise a conductive coating on a non-conductivecore.
 4. The fabric-based item defined in claim 3 wherein the conductivefibers comprise a locally stripped insulating coating.
 5. Thefabric-based item defined in claim 2 wherein the third fiber of thefirst set of fibers is one of at least three insulating fibers of thefirst set of fibers that lie between the first and second fibers andthat each overlap the electrical component.
 6. The fabric-based itemdefined in claim 1 wherein the electrical component comprises alight-emitting diode.
 7. The fabric-based item defined in claim 1wherein the electrical component comprises a sensor.
 8. The fabric-baseditem defined in claim 1 wherein the first and second directions areorthogonal.
 9. A fabric-based item, comprising: a woven fabric, whereinthe woven fabric comprises interwoven insulating strands and conductivestrands; and an electrical component having first and second opposingsurfaces and having first and second parallel grooves in the firstsurface, wherein a conductive strand in the conductive strands iselectrically connected to the electrical component in the first grooveand wherein an insulating strand in the insulating strands is in contactwith the second opposing surface.
 10. The fabric-based item defined inclaim 9 wherein the conductive strand is parallel to the insulatingstrand.
 11. The fabric-based item defined in claim 10 furthercomprising: an additional conductive strand that is electricallyconnected to the electrical component in the second groove.
 12. Thefabric-based item defined in claim 11 further comprising: an additionalinsulating strand that is orthogonal to the insulating strand, whereinthe insulating strand is interposed between the additional insulatingstrand and the electrical component.
 13. The fabric-based item definedin claim 12 wherein the first and second grooves have curved sides. 14.The fabric-based item defined in claim 9 wherein the electricalcomponent comprises an electrical device enclosed in a plastic package,and wherein the first and second grooves are formed in the plasticpackage.
 15. The fabric-based item defined in claim 14 furthercomprising: metal traces that extend through the plastic package andcouple terminals of the electrical device to respective contacts in thefirst and second grooves.
 16. The fabric-based item defined in claim 15further comprising: conductive shield structures that shield theelectrical device.
 17. The fabric-based item defined in claim 14,wherein the plastic package is elongated and extends along alongitudinal axis and wherein the first and second grooves areorthogonal to the longitudinal axis.
 18. A fabric-based item,comprising: a fabric formed from intertwined fibers that include first,second, and third parallel fibers, wherein the third fiber is interposedbetween the first and second fibers; and an array of electricalcomponents, each having first and second opposing surfaces, wherein eachelectrical component has first and second parallel grooves in the firstsurface, wherein a contact in the first groove is electrically coupledto the first fiber, wherein the second groove is coupled to the secondfiber, and wherein the electrical component is interposed between thefirst fiber and the third fiber.
 19. The fabric-based item defined inclaim 18 wherein the array of electrical components forms a touch sensorarray.
 20. The fabric-based item defined in claim 18 wherein eachelectrical component in the array of electrical components comprises alight emitting diode and each electrical component in the array ofelectrical components operates as a pixel in a display.